- Description
-
Details
SPEC.No. LH14Z02B
ISSUE Jul.04,2018
Laser Business Unit Electronic Components And Devices BU
SHARP CORPORATION
TECHNICAL LITERATURE
DEVICE TECHNICAL LITERATURE FOR
Laser Diode
MODEL No.
ＧＨ０８５２ＷＡ２Ｇ
◆ This technical literature is subject to change without notice. ◆
SHARP CORPORATION
ELECTRONIC COMPONENTS AND DEVICES GROUP
SPEC.No. LH14Z02B
PAGE 1
Product name : Laser Diode Model No. : GH0852WA2G
- These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp").
Please handle with great cares and do not reproduce or cause anyone to reproduce them without Sharp's consent.
- When using this Sharp product, please observe the absolute maximum ratings, other conditions and instructions for use described in the specification sheets, as well as the precautions mentioned below.
Sharp assumes no responsibility for any damages resulting from use of the product which does not comply with absolute maximum ratings, other conditions and instructions for use included in the specification sheets, and the precautions mentioned below.
(Precautions)
(1) In making catalogue or instruction manual based on the specification sheets, please verify the validity of the catalogue or instruction manuals after assembling Sharp products in customer's products at the responsibility of customer.
(2) This Sharp product is designed for use in the following application areas ;
- Computers • OA equipment • Telecommunication equipment (Terminal) • Measuring equipment
- Tooling mach* OA equipment * Audio visual equipment * Home appliance
If the use of the * Telecommunication equipment (Terminal) * Measuring equipment please be sure to* Tooling machines * Computers
(3) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when Sharp product is used for equipment in responsibility of customer which demands high reliability and safety in function and precision, such as ;
- Transportation control and safety equipment (aircraft, train, automobile etc.)
- Traffic signals • Gas leakage sensor breakers • Rescue and security equipment
- Other safety equipment
(4) Sharp product is designed for consumer goods and controlled as consumer goods in production and quality.
Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ;
- Space equipment • Telecommunication equipment (for trunk lines)
- Nuclear power control equipment • Medical equipment
(5) Please contact and consult with a Sharp sales representative if there are any question regarding interpretation of the above four paragraphs.
- Disclaimer
The warranty period for Sharp product is one (1) year (or six (6) months in case of generalized product) after shipment. During the period, if there are any products problem, Sharp will repair (if applicable), replace or refund.
Except the above, both parties will discuss to cope with the problems.
The failed Sharp product after the above one (1) year ( or six (6) month for generalized product) period will be coped
with by Sharp, provided that both parties shall discuss and determine on sharing responsibility based on the analysis results thereof subject to the above scope of warranty.
The warranty described herein is only for Sharp product itself which are purchased by or delivered to customer. Damages arising from Sharp product malfunction or failure shall be excepted.
Sharp will not be responsible for the Sharp product due to the malfunction or failures thereof which are caused by:
(1) storage keep trouble during the inventory in the marketing channel.
(2) intentional act, negligence or wrong/poor handling.
(3) equipment which Sharp products are connected to or mounted in.
(4) disassembling, reforming or changing Sharp products.
(5) installation problem.
(6) act of God or other disaster (natural disaster, fire, flood, etc.)
(7) external factors (abnormal voltage, abnormal electromagnetic wave, fire, etc.)
(8) special environment (factory, coastal areas, hotspring area, etc.)
(9) phenomenon which cannot be foreseen based on the practical technologies at the time of shipment.
(10) the factors not included in the product specification sheet.
- Please contact and consult with a Sharp sales representative for any questions about Sharp product.
MODEL No.
GH0852WA2G
PAGE
2
SPEC.No.LH14Z02A
- Scope
This technical literature covers the appearance and characteristics of infra red Laser Diode, Model No. GH0852WA2G
【Outline of this product】
This product is equipped with an GaAlAs multiple quantum well infra red laser diode . Oscillating transverse mode of this model is TE.
- Outline Dimensions and Terminal Connections described in page 3
- Ratings and Characteristics described in page 4
- Reliability described in page 5
- Incoming inspection described in page 6
- Supplements
6-1. ODS materials described in page 6
6-2. RoHS compliant product described in page 6 6-3. Chemical substance information in the product described in page 6 6-4. Packing described in page 7
6-5. Production place described on the labels, which are on the clean bag and on the packing case.
- Operating and handling precautions described in page 8
2. Outline dimensions and Terminal connections
X
(Note2）90°±2
MODEL No. GH0852WA2G SPEC.No.LH14Z02A
PAGE
3
1 ② Enlarged drawing around the
2 emission point
Y X Emission point
3
(Note3) 0.4±0.1
0±0.08
Y
Emission point
③ (Note2)φ5.6+0
-0.025 φ4.4MAX.
0±0.08
Center of the imaginary circle which goes through the three point around the stem
C 0.1MAX.
φ3.55±0.1 φ1MIN.
Z
④ Terminal connections
2 Stem
① Non connect
0.5MIN.
Reference plane
3
LD
Cathode
1
LD
Anode
φ1.2MAX.
3-φ0.45±0.1
⑤ 2 1，3
General Tolerances: ±0.2 Unit: mm
Mass of the product: 0.32g（reference value）
Marking
Position : Top or side of a cap Printed contents : T.B.D.
(Note 1) Dimension of the bottom of leads.
(Note 2) These dimensions are valid only in the range of 0~0.6mm below from the reference plane.
(Note 3) These dimensions are defined from the imaginary circle which goes through the three points around the stem to the bottom of cut off parts.
- Ratings and Characteristics
MODEL No. GH0852WA2G SPEC.No.LH14Z02A
PAGE
4
3-1 Absolute Maximum Ratings (Tc=25℃(Note 1))
Parameter
Symbol
Value
Unit
Optical power output (CW) (Note 2)
Po
700
mW
Optical power output (Pulse) (Note 3)
Pp
2,000
mW
Reverse voltage
Vrl
2
V
Operating temperature (Case temperature)
Top(c)
-10 ～ +70
℃
Storage temperature
Tstg
-40 ～ +85
℃
Soldering temperature (Note 4)
Tsld
350
℃
(Note 1) Tc : Case temperature
(Note 2) CW : Continuous Wave Operation
(Note 3) Pulse : Pulse Operation (Pulse Width:1μs Duty:10%)
(Note 4) Soldering temperature means soldering iron tip temperature（The power 20W) while soldering.
Soldering position is 1.6mm apart from bottom edge of the case.(Immersion time: ≦3s) 3-2 Electro-optical Characteristics (Tc=25℃(Note 1))
(Note 1) Initial value, Continuous Wave Operation (Note 2) Full angle of 13.5(≒1/e2) peak intensity (Note 3) Parallel to the junction plane(X-Z plane)
Perpendicular to the junction plane(Y-Z plane) (Note 4) This laser is multi-mode laser.
Parallel (Horizontal) FFP does not become Gaussian distribution. (Note 5) Definition of K-LI
K-LI = ( P4 - P3 ) / P3
Least squares linear fit
P4 between P1 and P2
P3
real I-L Data
P2
P1
Ip1 Ip2 Ip3 Driving Current
- Reliability
4-1 The reliability of products satisfy all the items listed below.
MODEL No.
GH0852WA2G
SPEC.No.LH14Z02A
PAGE
5
Reference Standards : JIS Confidence level : 90
No.
Test
Test Conditions
Samples:n
Defective:C
LTPD()
Failure criteria No. [4-2]
1
Solderability
Soldering temperature: 240±5℃(Flux used)
Immersion time:5±0.5s
11
0
20
1
2
Resistance to soldering
Soldering iron tip temperature: 350±5℃ Immersion time:3±1s(Note 1)
11
0
20
3,4,5
3
Terminal strength
(Tensile test)
Load:5N Duration:5±1s
Once for each terminal
11
0
20
2
4
Terminal strength (Bending test)
Load:2.5N 0ﾟ～90ﾟ～ 0ﾟ～ -90ﾟ～0ﾟ Once for each terminal
11
0
20
2
5
Mechanical shock
Acceleration:1000m/s2 Pulse width:6ms
Direction:±X,±Y and ±Z Three times for each direction
11
0
20
3,4,5
6
Variable frequency vibration
Acceleration:100m/s2 or Amplitude:1.5mm Frequency:
10～500～10Hz 15min reciprocation Direction:
X,Y and Z 2 h for each direction
11
0
20
3,4,5
7
Temperature cycling
Lower temperature:-40℃ Higher temperature:+85℃ Duration:30min each, 30 times
11
0
20
3,4,5
8
High temperature
storage
Storage temperature:85℃
t=500 h
11
0
20
3,4,5
9
Low temperature
storage
Storage temperature:-40℃
t=500 h
11
0
20
3,4,5
(Note 1) Soldering position is 1.6mm apart from bottom edge of the case.
(Note 2) To be measured after 72 hours exposure to the room atmosphere.
(Note 3) These test results are sampling examples from a specific lot for reference purpose only, and do not constitute any warranty or assurance in connection with the devices.
4-2 Parameters to be measured and Failure criteria
No.
Parameters
Failure judgment criteria
1
Solderability
95 or more is covered with solder.
2
Terminal strength
It is defective if there are breaking and loosening.
3
Threshold current
Ith > initial value ×1.2, Ith < initial value ×0.8
4
Operating current
Iop > initial value ×1.2, Iop < initial value ×0.8
5
Operating voltage
Vop > initial value ×1.1, Vop < initial value ×0.9
4-3 Lifetime Test
The target mean time to failure (MTTF) of this product is more than 5,000 h. MTTF is confirmed
by performing the operating test under the following conditions in time of development or change process related to the reliability of this product.
Samples tested should have a laser diode chip with the same structure of this model.
Conditions
Failure judgment criteria
Tc=70℃,
Failure is defined as the time under the operating power under the conditions
If=1A,
in the left changes 20 of the initial (12 h) value.(Note 1)
500 hours
As for the samples which do not fail within 500 hours, their life time is calculated
ACC operation
by extrapolating operating power data of between 400 and 500 hours.
MTTF is estimated by plotting each life time in Weibull function worksheet.(Note 1)
(Note 1) Defective samples caused by surge current is rejected.
(Note 2) These test results are sampling examples from a specific lot for reference purpose only, and do not constitute any warranty or assurance in connection with the devices.
5. Incoming inspection
5-1 Inspection standards ISO 2859 single sampling plan 5-2 Inspection level S-2 normal inspection
5-3 AQL
5-3-1 Definition of the lot the day shipping the product 5-3-2 Characteristics
MODEL No. GH0852WA2G SPEC.No.LH14Z02A
PAGE
6
(Note1) Inspection is performed after blowing. 5-3-3 Appearance
6. Supplements
6-1 ODS materials
This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product.
Materials for ODS : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform)
6-2 RoHS compliant product
This product complies with the RoHS Directive (2011/65/EU) and manufactured in accordance with Sharp's Green Device Guidelines.
6-3 Chemical substance information in the product
Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by Electronic Information Products.
Names and Contents of the Toxic and Hazardous Substances or Elements in the Product
Lead (Pb)
Mercury (Hg)
Cadmium (Cd)
Hexavalent Chromium (Cr(VI))
Polybrominated Biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
○
○
○
○
○
○
○ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described
in GB/T26572 standard.
× : indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part exceeds the concentration limit requirement as described in GB/T26572 standard.
6-4. Packing
6-4-1. Packing method
(1) Laser diodes are arranged in a tray.
(2) One tray can accommodate 200 lasers maximum.
MODEL No. GH0852WA2G SPEC.No.LH14Z02A
PAGE
7
(3) A vacant tray is stacked as a cover on the tray wherein the laser diodes are arranged. including a cover are bound with adhesive tape.
(4) The above bound trays are stuffed into a clean-bag. The bag is sealed by dissolving thermally.
(5) The trays in the bag are put into a packing case. One packing case can accommodate 2 000 lasers maximum, which is the minimum unit of packing. A Label where in the model number ,quantity and lot number are printed is stuck on both of the bag and the case (Refer to 6-4-4).
6-4-2. Materials for packing
No.
Component parts
Material
1
Laser tray
conductive polystyrene resin
2
Tray cap
conductive polystyrene resin
3
Clean-bag
anti‐static plastic
4
Packing case
cardboard
5
shock absorber
anti‐static polyethylene
6-4-3. External appearance of packing (unit:mm)
265
shock absorber
Clean-bag
215
Packing case
95
Laser tray
Tray cap Laser Diode
6-4-4. Label
(1) A label on the clean-bag (2)A label on the packing case
TYPE Q'TY LOT
Model No. (Note2) Quantity
Lot No. (Shipping Date)
TYPE Q'TY LOT
Model No. (Note2) Quantity
Lot No. (Shipping Date)
SHARP CORPORATION
MADE IN ****(Note 1)
（Note 3）
SHARP CORPORATION
MADE IN ****(Note 1)
（Note 3）
(Note 1) **** : Production country
(Note 2) A management number in the factory is written in ( ), if the product produced in a factory except Japan.
(Note 3) This identification mark shows the settlement product for RoHS
designed by using a green material based on our green device guideline.
MODEL No.
GH0852WA2G
PAGE
8
SPEC.No.LH14Z02A
7. Operating and handling precautions
(1) This product has its life. The product life which is described in "4. Reliability" should be taken into account when using it.
(2) This product will be damaged by electrostatic discharge (ESD). Following precautions should be taken to avoid ESD damage.
⇒ Workers, workbenches and other equipment should always be grounded. Workers should always wear an antistatic wrist strap and an antistatic smock on them.
⇒ When handling this product, workers should always wear antistatic gloves or finger covers.
⇒ A stable DC power supply which is free from electrical transients should always be used when operating this product. A slow starter circuit should always be inserted between the power supply and this product in order to protect it from DC power surges.
⇒ Optical power output of this product should be set with a highly reliable and high quality variable resistance.
⇒ This product should always be connected to the driving circuit by soldering directly or through highly reliable connectors.
⇒ While this product is being operated, be sure to avoid touching the driving circuit or the terminals of this product with electrical probes from a synchroscope or a voltmeter.
⇒ An antistatic package should be used when storing this product.
⇒ This product should be processed in the rooms where relative humidity is kept at 50-70RH.
(3) Process products in clean rooms, and avoid touching with bare hands. Because laser beam is highly coherent, dust traces or fingerprints on the window glass are sufficient to interfere with
the passing beam, causing ripples in the far field pattern.
(4) A sufficient heat sink should be attached to this product when operating so that its case temperature is to be maintained at the same level as that of the surrounding.
(5) Even if the drive current supply has an automatic power control (APC), automatic current control (ACC), or both, be sure to monitor the optical power output with an optical power meter while setting it. Never estimate the optical power output only from the drive current because it is likely to be decreased by temperature rise of the surrounding.
(6) If the window glass of this product should become soiled, gently clean it with a cotton swab dipped in ethyl alcohol.
(7) Do not allow the heat sink to apply excessive pressure to the package cap. Because a window glass is as thin as 0.25mm.
(8) Although the beam emitted by this laser diodes is nearly invisible, it will be harmful to the human eyes. So the following precautions should be taken.
⇒ When this product is being operated, the emitting surface of a chip should not be viewed either directly or through a lens, microscope or optical fibers.
⇒ When operating this product, wear safety glasses.
⇒ To adjust the optical axis of this laser diode and peripheral devices, use an IR scope or a fluorescent screen that converts infrared light to visible light.
(9) When soldering this product, heat lead pins only using a soldering iron. Avoid heat the whole package using pre-heat or reflow soldering.
- Additional Information
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Additional Information
Wavelength 850nm Output 500mW-999mW SKU 11081074 - Reviews
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